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NTMS4920N
Power MOSFET
30 V, 17 A, N ? Channel, SO ? 8
Features
? Low R DS(on) to Minimize Conduction Losses
? Low Capacitance to Minimize Driver Losses
? Optimized Gate Charge to Minimize Switching Losses
? These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
Applications
? DC ? DC Converters
? Points of Loads
? Power Load Switch
? Motor Controls
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter Symbol
Drain ? to ? Source Voltage
V DSS
Gate ? to ? Source Voltage
V GS
Value
30
± 20
Unit
V
V
V (BR)DSS
30 V
R DS(ON) MAX
4.3 m W @ 10 V
5.7 m W @ 4.5 V
N ? Channel
D
I D MAX
17 A
Continuous Drain
Current R q JA (Note 1)
Power Dissipation R q JA
(Note 1)
Continuous Drain
Current R q JA (Note 2)
Steady
State
Steady
State
Steady
State
T A = 25 ° C
T A = 70 ° C
T A = 25 ° C
T A = 25 ° C
T A = 70 ° C
I D
P D
I D
14.1
11.3
1.46
10.6
8.5
A
W
A
G
S
MARKING DIAGRAM/
PIN ASSIGNMENT
Source
Source
Gate
Power Dissipation R q JA T A = 25 ° C
(Note 2)
Continuous Drain Steady T A = 25 ° C
Current R q JA , t v 10 s State
(Note 1) T A = 70 ° C
Power Dissipation Steady T A = 25 ° C
R q JA , t v 10 s(Note 1) State
Pulsed Drain Current T A = 25 ° C, t p = 10 m s
Operating Junction and Storage Temperature
P D
I D
P D
I DM
T J ,
T stg
0.82
17
13.6
2.12
136
? 55 to
150
W
A
W
A
° C
1
1 Source
SO ? 8
CASE 751
STYLE 12
Top View
4920N = Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb ? Free Package
8
Drain
Drain
Drain
Drain
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche Energy
(T J = 25 ° C, V DD = 30 V, V GS = 10 V,
I L = 18 A pk , L = 1.0 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I S
E AS
T L
2.1
162
260
A
mJ
° C
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping ?
NTMS4920NR2G SO ? 8 2500/Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Parameter
Junction ? to ? Ambient – Steady State (Note 1)
Junction ? to ? Ambient – t v 10 s (Note 1)
Junction ? to ? Foot (Drain)
Junction ? to ? Ambient – Steady State (Note 2)
Symbol
R q JA
R q JA
R q JF
R q JA
Value
85.5
59
25
152
Unit
° C/W
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surfacemounted on FR4 board using the minimum recommended pad size.
? Semiconductor Components Industries, LLC, 2009
September, 2009 ? Rev. 1
1
Publication Order Number:
NTMS4920N/D
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